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US 2013/0239694 A1Published application
Pressure sensor chip
AssigneeAzbil Corporation
InventorsYuuki SETO, Tomohisa TOKUDA
Life of this patent
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Abstract
A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.
Claims5
1:
- A pressure sensor chip comprising:
- a sensor diaphragm that outputs a signal in accordance with a pressure differential;
- and
- first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith, wherein,
- in the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm,
- a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and
- a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.
4 more elements
2:
- The pressure sensor chip as set forth in claim 1, wherein,
- in the sensor diaphragm,
- the one face is a pressure bearing face for a measurement pressure of a high-pressure side, and
- the other face is a pressure bearing face for a measurement pressure of a low-pressure side.
1 more element
3:
- The pressure sensor chip as set forth in claim 1, wherein,
- in the peripheral edge portion of the second holding member, in a region that faces the other face of the sensor diaphragm,
- a region on an outer peripheral side is a region that is bonded to the other face of the sensor diaphragm, and
- a region on an inner peripheral side is a region that is not bonded to the other face of the sensor diaphragm.
1 more element
4:
- The pressure sensor chip as set forth in claim 1, wherein
- the non-bonded region of the peripheral edge portion of the first holding member is a small step established at no more than a specific ratio of a sensor diaphragm thickness.
5:
- The pressure sensor chip as set forth in claim 1, wherein
- either the first holding member or the second holding member is provided with a recessed portion to stop excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.