# US 2013/0239408 A1 · Power and ground vias for power distribution systems > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0239408 A1 - Document ID: US20130239408A1 - Status: Published application - Kind: A1 - Application number: 13/888,595 - Filed: 2013-05-07 - Published: 2013-09-19 - Earliest claimed: 2010-05-10 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Tae Hong Kim; Sang Y. Lee; Nam H. Pham - Web page: https://patentgrep.com/patent/US20130239408A1 ## CPC - H05K 3/40: Forming printed elements for providing electric connections to or between printed circuits - H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape. ## Claims ### Claim at position 1 -13. (canceled) ### Claim 14 A method comprising: providing a power source including a terminal; providing one of a power plane and a ground plane; and forming a via filled with a conductive material that forms a conductive pathway that connects the terminal of the power source to the one of the power plane and the ground plane, wherein the via has a cross-section of at least three partially-overlapping shapes, and wherein each of the shapes partially overlaps at least two of the other shapes. ### Claim 15 (depends on 14) The method of claim 14, wherein the shapes are each circular. ### Claim 16 (depends on 15) The method of claim 15, wherein the shapes have a diameter between about 8 mils and about 18 mils. ### Claim 17 (depends on 14) The method of claim 14, wherein forming the via comprises: forming at least-three partially-overlapping circular holes to define an aperture between the terminal of the power source and the one of the power plane and the ground plane; and substantially filling the aperture with conductive material to electrically connect the power source and the one of the power plane and the ground plane. ### Claim 18 (depends on 14) The method of claim 14, wherein the shapes are each one of triangular, rectangular, square, polygonal, and rhomboidal shape. ### Claim 19 (depends on 14) The method of claim 14, wherein at least two of the shapes are of different types. ### Claim 20 (depends on 14) The method of claim 14, wherein at least two of the shapes are of different sizes. ### Claim 21 A method comprising: providing a power source including a power supply voltage terminal and a power supply ground terminal; providing a power plane; providing a ground plane; forming a first via filled with a conductive material that forms a first conductive pathway that electrically connects the power plane to the power supply voltage terminal of the power source, wherein the first via has a cross-section of at least partially-overlapping circular shapes, and wherein each one of the circular shapes partially overlaps at least two of the other circular shapes; and forming a second via filled with a conductive material that forms a second conductive pathway that electrically connects the ground plane to the power supply ground terminal of the power source, wherein the second via has a cross-section of at least three partially-overlapping circular shapes, and wherein each of the circular shapes partially overlaps at least two of the other circular shapes. ### Claim 22 (depends on 21) The method of claim 21, further comprising: providing first and second conductive components for electrical connection to an electronic component; and forming a third via electrically connecting the power plane and the first conductive component, wherein the third via has a cross-section of at least partially-overlapping circular shapes, and wherein each one of the circular shapes partially overlaps at least two of the other circular shapes; and forming a fourth via electrically connecting the ground plane and the second conductive component, wherein the fourth via has a cross-section of at least three partially-overlapping circular shapes, and wherein each of the circular shapes partially overlaps at least two of the other circular shapes. ### Claim 23 (depends on 21) The method of claim 21, wherein the circular shapes have a diameter between about 8 mils and about 18 mils. ### Claim 24 (depends on 21) The method of claim 21, wherein at least two of the circular shapes are of different sizes. ### Claim 25 (depends on 21) The method of claim 21, wherein the shapes are each circular. ### Claim 26 (depends on 21) The method of claim 21, wherein the shapes are each one of triangular, rectangular, square, polygonal, and rhomboidal shape. ### Claim 28 (depends on 21) The method of claim 21, wherein forming the first via comprises: forming at least-three partially-overlapping circular holes to define an aperture between the power plane and the power supply voltage terminal of the power source; and substantially filling the aperture with conductive material to electrically connect the power plane and the power supply voltage terminal of the power source. ### Claim 29 (depends on 21) The method of claim 21, wherein forming the second via comprises: forming at least-three partially-overlapping circular holes to define an aperture between the ground plane and the power supply ground terminal of the power source; and filling the aperture with conductive material to electrically connect the ground plane and the power supply ground terminal of the power source.