# US 2013/0239404 A1 · System and Method for Integrated Inductor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0239404 A1 - Document ID: US20130239404A1 - Status: Published application - Kind: A1 - Application number: 13/888,185 - Filed: 2013-05-06 - Published: 2013-09-19 - Earliest claimed: 2010-01-12 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Carsten Ahrens; Gunther Mackh; Klemens Pruegl - Web page: https://patentgrep.com/patent/US20130239404A1 ## CPC - H01F 27/2804: {Printed windings} - H01F 5/00: Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) - H01F 17/04: with magnetic core - H01F 27/255: made from particles (H01F27/26 takes precedence) - H01F 41/046: {structurally combined with ferromagnetic material} - H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern - H10D 1/20: Inductors - H10D 84/00: Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers - H10W 20/497: {Inductive arrangements or effects of, or between, wiring layers} - H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5525: {comprising copper [Cu]} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - Y10T 29/49075: including permanent magnet or core - Y10T 29/49155: Manufacturing circuit on or in base - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract In one embodiment, an inductor has a substrate, a conductor disposed above the substrate and a seamless ferromagnetic material surrounding at least a first portion of the conductor. ## Claims ### Claim 1 A method of manufacturing a circuit, the method comprising: depositing a conductive line on a substrate; removing a portion of the substrate adjacent to at least a portion of the conductive line; and depositing a seamless magnetic material surrounding at least the portion of the conductive line. ### Claim 2 (depends on 1) The method of claim 1, further comprising forming the substrate, wherein forming the substrate comprises depositing a dummy layer on a first substrate layer before depositing the conductive line, wherein removing the portion of the substrate adjacent to at least the portion of the conductive line comprises removing at least a portion of the dummy layer underneath at least the portion of the conductive line. ### Claim 3 (depends on 1) The method of claim 1, wherein removing the portion of the substrate adjacent to at least the portion of the conductive line comprises etching a cavity into at least a portion of the substrate beneath at least the portion of the conductive line. ### Claim 4 (depends on 1) The method of claim 1, wherein depositing the conductive line on the substrate comprises depositing the conductive line inside the substrate. ### Claim 5 (depends on 1) The method of claim 1, wherein depositing the conductive line on the substrate comprises depositing the conductive line over the substrate. ### Claim 6 (depends on 1) The method of claim 1 wherein removing the portion of the substrate comprises etching the portion of the substrate through the entire substrate. ### Claim 7 (depends on 1) The method of claim 1, further comprising forming a pad coupled to the conductive line. ### Claim 8 (depends on 1) The method of claim 1, wherein depositing the seamless magnetic material comprises depositing a magnetic mold material. ### Claim 9 (depends on 8) The method of claim 8, wherein depositing the magnetic mold material comprises injecting a polymer comprising magnetic particles around the conductive line. ### Claim 10 (depends on 1) The method of claim 1, wherein the circuit comprises an inductor. ### Claim 11 (depends on 1) The method of claim 1, wherein the depositing the seamless magnetic material comprises depositing magnetic particles. ### Claim 12 (depends on 1) The method of claim 1, wherein removing the portion of the substrate comprises: etching a first portion of the substrate from a top side of the substrate; and grinding or etching a second portion of the substrate from a back side of the substrate. ### Claim 13 A method of forming an inductor, the method comprising: providing a substrate; forming a conductive line on the substrate; etching a portion of the substrate adjacent to at least a portion of the conductive line; and forming a seamless magnetic material around at least the portion of the conductive line. ### Claim 14 (depends on 13) The method of claim 13, wherein the substrate comprises silicon. ### Claim 15 (depends on 13) The method of claim 13, wherein forming the conductive line comprises disposing copper on the substrate. ### Claim 16 (depends on 13) The method of claim 13, wherein forming the seamless magnetic material comprises: forming a mold with a mold material comprising ferrite particles, forming the mold comprising using a mold tool having a cavity that defines outside dimensions of the seamless magnetic material. ### Claim 17 (depends on 13) The method of claim 13, wherein etching the portion of the substrate comprises etching the substrate beneath the conductive line. ### Claim 18 A method of forming an inductor comprising: providing a substrate; forming a trench in the substrate; forming a conductor in the trench; forming a gap extending from a top surface of the substrate through a bottom surface of the substrate; and forming a seamless magnetic material surrounding at least a first portion of the conductor and filling the gap. ### Claim 19 (depends on 18) The method of claim 18, wherein forming the trench comprises forming a deep trench. ### Claim 20 (depends on 18) The method of claim 18, wherein the gap is disposed adjacent to a first side of the first portion of the conductor.