Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
AssigneePlasma-Therm LLC
InventorsChris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Abstract
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
Claims43
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A method for plasma dicing a substrate, the method comprising:
- providing a process chamber having a wall;
- providing a plasma source adjacent to the wall of the process chamber;
- providing a work piece support within the process chamber;
- providing a lifting mechanism within the work piece support;
- placing the substrate onto a support film on a frame to form the work piece;
- loading the work piece onto the lifting mechanism;
- generating a plasma through the plasma source;
- and
- etching the work piece through the generated plasma.
An apparatus for plasma dicing a substrate comprising:
- a process chamber having a wall;
- a plasma source adjacent to the wall of the process chamber;
- a work piece support within the process chamber;
- a work piece having the substrate on a support film on a frame;
- and
- a lifting mechanism within the work piece support, the work piece being placed onto the lifting mechanism.
Dependencies are inferred from the claim text.