Method of Applying a Pattern to a Substrate, Device Manufacturing Method and Lithographic Apparatus for Use in Such Methods

A lithographic apparatus arranged to transfer a pattern from a patterning device onto a substrate, the apparatus comprising:

• a patterning subsystem configured to apply the pattern from the patterning device to a portion of the substrate held at a patterning location;
• a substrate support configured to hold the substrate while the pattern is applied;
• a measurement subsystem configured to measure the locations of alignment marks on the substrate relative to a reference frame of the apparatus;
• and
• a controller configured to operate the lithographic apparatus to apply the pattern at one or more desired locations on a substrate held on the substrate support, the controller being further configured to generate first correction information based on the locations of alignment marks measured by the measurement subsystem after loading the substrate on the substrate support, to retrieve from a data store second correction information based on measurements of alignment marks made prior to loading the substrate, and to use the first and second correction information in combination to position the applied pattern at the desired location.