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US 2013/0221503 A1Published application
Semiconductor package
AssigneeLapis Semiconductor Co., Ltd.
InventorTae Yamane
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a semiconductor chip; a base member on which the semiconductor chip is mounted; a plurality of leads formed on the base member, the leads including inner ends electrically connected to the semiconductor chip and outer ends; and an index for identifying locations of specific leads.
Claims11
A semiconductor device, comprising:
- a semiconductor chip having a first side and a second side opposite the first side;
- a plurality of electrode pads disposed on the semiconductor chip along the first side;
- a base member on which the semiconductor chip is mounted;
- and a first index lead, a second index lead and a plurality of inner leads disposed on the base member, the inner leads being arranged between the first index lead and the second index lead, and the first index lead, the second index lead and the inner leads being electrically connected with the electrode pads of the semiconductor chip across the first side of the semiconductor chip,
- wherein a first distance between ends of the first and second index leads and the first side is longer than a second distance between each of ends of the inner leads and the first side, and
- wherein all ends of the inner leads are coincident with a line which is in parallel to the first side.
3 more elements
Dependencies are inferred from the claim text.