Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTsuneo OGURA, Tomoko MATSUDAI, Yuichi OSHINO
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsTsuneo OGURA, Tomoko MATSUDAI, Yuichi OSHINO
Estimating the term…
According to one embodiment, a semiconductor device includes a first electrode, a first conductivity type cathode layer, a first conductivity type base layer, a second conductivity type anode layer, a second conductivity type semiconductor layer, a first conductivity type semiconductor layer, an buried body, and a second electrode. The first conductivity type semiconductor layer is contiguous to the second conductivity type semiconductor layer in a first direction, and extends on a surface of the anode layer in a second direction that intersects perpendicularly to the first direction. The buried body includes a bottom portion and a sidewall portion. The bottom portion is in contact with the base layer. The sidewall portion is in contact with the base layer, the anode layer, the second conductivity type semiconductor layer and the first conductivity type semiconductor layer. The buried body extends in the first direction.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.