Capillary exchange system of semiconductor wire bonding
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung Sik KIM, Doo Jin KIM, Sung Bok HONG, Ki Taik OH
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Abstract
A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.
Claims20
A capillary exchange system for use in semiconductor wire bonding, the capillary exchange system comprising:
- a wire bond unit having a chuck that includes a holding portion configured to hold a semiconductor wire bonding capillary;
- a holding release guide unit configured to mechanically act on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or to be released from the holding portion;
- and
- a capillary exchange unit configured to separate the capillary from the chuck of the wire bond unit, the capillary exchange unit further configured to install a new capillary in the chuck in cooperation with the holding release guide unit.
A capillary exchange device comprising:
- a holding portion configured to hold a semiconductor wire bonding capillary;
- a holding release guide unit configured to release the capillary from the holding portion;
- and
- a capillary exchange unit configured to separate the capillary from the holding portion, the capillary exchange unit further configured to install a new capillary in the holding portion.
Dependencies are inferred from the claim text.