Hybrid plasma processing systems

A plasma processing system having a plasma processing chamber for processing a substrate, comprising:

• a first RF power supply;
• a second RF power supply;
• a lower electrode for supporting said substrate during said processing, said lower electrode being energized by said first RF power supply;
• a hybrid upper electrode disposed in a spaced-apart relationship above said lower electrode and comprising
• a first plate formed of a first material having a first electrical resistivity,
• a conductive grounded plate having therein a first plurality of radial slots, said conductive plate being disposed, relative to said lower electrode, more distally than said first plate, said conductive plate formed of a second material having a second electrical resistivity different from said first electrical resistivity,
• an electrically insulative plate having at least one channel disposed therein, said electrically insulative plate disposed, relative to said lower electrode, more distally than said conductive ground plate,
• an inductive coil disposed within said at least one channel of said electrically insulative plate, said inductive coil being energized by said second RF power supply.

A method for processing a substrate in a plasma processing system having a plasma processing chamber for processing a substrate, comprising:

• providing a first RF power supply;
• providing a second RF power supply;
• providing a lower electrode for supporting said substrate during said processing, said lower electrode being energized by said first RF power supply;
• providing a hybrid upper electrode disposed in a spaced-apart relationship above said lower electrode and comprising
• a first plate formed of a first material having a first electrical resistivity, said first plate having therein a first plurality of radial slots,
• a conductive grounded plate having therein a second plurality of radial slots, said conductive plate being disposed, relative to said lower electrode, more distally than said first plate, said conductive plate formed of a second material having a second electrical resistivity lower than said first electrical resistivity,
• an electrically insulative plate having at least one channel disposed therein, said electrically insulative plate disposed, relative to said lower electrode, more distally than said conductive ground plate,
• an inductive coil disposed within said at least one channel of said electrically insulative plate, said inductive coil being energized by said second RF power supply;
• and
• processing said substrate while energizing at least one of said lower electrode and said inductive coil using at least one of said first RF power supply and said second RF power supply respectively.