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US 2013/0220804 A1Published application
Ferromagnetic Material Sputtering Target
AssigneeJX Nippon Mining & Metals Corporation
InventorsAtsutoshi Arakawa, Yuki Ikeda
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AssigneeJX Nippon Mining & Metals Corporation
InventorsAtsutoshi Arakawa, Yuki Ikeda
Estimating the term…
Provided is a ferromagnetic material sputtering target having a metal composition comprising 5 mol % or more of Pt and the balance of Co, wherein the target has a structure including a metal base (A) and a phase (B) of a Co—Pt alloy containing 40 to 76 mol % of Pt in the metal base (A). Further provided is a ferromagnetic material sputtering target having a metal composition comprising 5 mol % or more of Pt, 20 mol % or less of Cr, and the balance of Co, wherein the target has a structure including a metal base (A) and a phase (B) of a Co—Pt alloy containing 40 to 76 mol % of Pt in the metal base (A). The present invention provides a ferromagnetic material sputtering target that can improve the leakage magnetic flux to allow stable discharge with a magnetron sputtering device.
A ferromagnetic material sputtering target having a metal composition comprising 5 mol % or more of Pt and the balance of Co, wherein the target has a structure including a metal base (A) and a phase (B) of a Co—Pt alloy containing 40 to 76 mol % of Pt in the metal base (A), and the phase (B) has a particle diameter of 10 μm or more and 150 μm or less.
A ferromagnetic material sputtering target having a metal composition comprising 5 mol % or more of Pt, 20 mol % or less of Cr, and the balance of Co, wherein the target has a structure including a metal base (A) and a phase (B) of a Co—Pt alloy containing 40 to 76 mol % of Pt in the metal base (A), and the phase (B) has a particle diameter of 10 μm or more and 150 μm or less.
(canceled)
Dependencies are inferred from the claim text.