Composite target and method for manufacturing the same

A method for manufacturing a composite target, which manufactures the composite target according an etching condition of a waste target, wherein the waste target is generated after an original target at least having a substrate layer and a metal layer is processed through a sputtering process by a sputtering apparatus with a first magnetic field line distribution, and the method includes:

• determining the etching condition of the waste target caused by the first magnetic field line distribution to decide a second magnetic field line distribution, wherein the second magnetic field line distribution is used to adjust the first magnetic field line distribution applied on the composite target while being disposed on the sputtering apparatus;
• disposing a magnetic layer corresponding to the second magnetic field line distribution on the substrate layer of the original target;
• disposing the metal layer on the magnetic layer and the substrate layer;
• and
• disposing a connection layer among the substrate layer, the magnetic layer and the metal layer to combine the substrate layer, the magnetic layer and the metal layer to form the composite target,
• when the composite target is used to perform the sputtering process, the composite target with the second magnetic field line distribution adjusts the first magnetic field line distribution applied on the composite target into to third magnetic field line distribution.