Multilayered printed wiring board and method for manufacturing the same
AssigneeDai Nippon Printing Co., Ltd.
InventorsTakahiro Sahara, Atsushi Kobayashi, Kiyoshi Takeuchi, Masahiko Igaue
Life of this patent
Estimating the term…
Abstract
A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
Claims11
A multilayered printed wiring board, comprising:
- a plurality of insulating layers;
- a plurality of wiring layers which are located between the corresponding adjacent insulating layers;
- and
- a plurality of interlayer connection conductors for electrically connecting said wiring layers through said insulating layers,
- wherein a cavity is formed through one or more of said insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for said insulating layers.
A method for manufacturing a multilayered printed wiring board, comprising the steps of:
- preparing a first printed wiring board and a second printed wiring board;
- forming, at said second printed wiring board, a first through-hole as a cavity for inserting a first electric/electronic component and a second through-hole for embedding a second electric/electronic component;
- mounting said second electric/electronic component on said first printed wiring board;
- forming conductive bumps to be converted into interlayer connection conductors on said second printed wiring board so as to be opposite to said first printed wiring board;
- and
- laminating said first printed wiring board and said second printed wiring board so that said first printed wiring board can be electrically connected with said second printed wiring board via said interlayer connection conductors.
Dependencies are inferred from the claim text.