Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board

A copper foil comprising a copper foil and a surface treatment layer, wherein the copper foil is obtained by a process comprising:

• forming a release layer, the copper foil, a roughening treatment layer, and the surface treatment layer in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more;
• and then
• peeling off the copper foil with the roughening treatment layer and the surface treatment layer from the carrier foil.

A copper foil comprising a copper foil and a surface treatment layer, wherein the copper foil is obtained by a process comprising:

• forming a release layer, the copper foil, optionally a roughening treatment layer, and the surface treatment layer in this order on a carrier foil that is made of an electrolytic copper foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more;
• and then
• peeling off the copper foil from the carrier foil.

A method for manufacturing a copper foil, the method comprising:

• forming a release layer and a copper foil in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more;
• and then
• peeling off the copper foil from the carrier foil.

A method for manufacturing a copper foil, the method comprising:

• forming a release layer, a copper foil, a roughening treatment layer, and a surface treatment layer in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more;
• and then
• peeling off the copper foil with the roughening treatment layer and the surface treatment layer from the carrier foil.

A method for manufacturing a copper foil, the method comprising:

• forming a release layer, a copper foil, optionally a roughening treatment layer, and a surface treatment layer in this order on a carrier foil that is made of an electrolytic copper foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more;
• and then
• peeling off the copper foil from the carrier foil.

A copper foil with a carrier, obtained by a process comprising forming a release layer and a copper foil in this order on a carrier foil having a treatment face with a surface roughness Rz of 1.5 μm or less,

• wherein a spacing between irregularities of ridges on a surface of the carrier foil on which the copper foil is formed is 25 μm or more in a mean spacing Sm as defined in JIS-B-06012-1994.

A copper foil with a carrier, obtained by a process comprising forming a release layer, a copper foil, a roughening treatment layer, and a surface treatment layer in this order on a carrier foil having a treatment face with a surface roughness Rz of 1.5 μm or less,

• wherein a spacing between irregularities of ridges on a treatment surface of the copper foil is 25 μm or more in a mean spacing Sm as defined in JIS-B-06012-1994.

A copper foil with a carrier, obtained by a process comprising forming a release layer, a copper foil, optionally a roughening treatment layer, and a surface treatment layer in this order on a carrier foil that is made of an electrolytic copper foil having a treatment face with a surface roughness Rz of 1.5 μm or less,

• wherein a spacing between irregularities of ridges on a treatment surface of the copper foil is 25 μm or more in a mean spacing Sm as defined in JIS-B-06012-1994.

A method for manufacturing a copper foil with a carrier, the method comprising forming a release layer and a copper foil in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more.

A method for manufacturing a copper foil with a carrier, the method comprising forming a release layer, a copper foil, a roughening treatment layer, and a surface treatment layer in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more.

A method for manufacturing a copper foil with a carrier, the method comprising forming a release layer, a copper foil, optionally a roughening treatment layer, and a surface treatment layer in this order on a carrier foil that is made of an electrolytic copper foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more.