Heavy-wire bond arrangement and method for producing same
AssigneeTechnische Universitaet Berlin
InventorAndreas Middendorf
Life of this patent
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Abstract
The invention relates to a heavy-wire bond arrangement, having a substrate (2), a heavy wire (1) and a high-voltage heavy-wire bond connection, in which an end bond section (4) of the heavy wire (1), which extends towards the end (7) of the heavy wire (1), is bonded to the substrate (2), such that in the area of the bond section (4) a bond contact (5) between the heavy wire (1) and the substrate (2) is formed, the heavy wire (1) having a tapering section (6) which adjoins the end of the wire (7) and in which the wire cross-section tapers towards the end of the wire (7). The application additionally relates to a method for producing a heavy-wire bond arrangement.
Claims12
Heavy-wire bond arrangement, having:
- a substrate;
- a heavy wire;
- and
- a high-voltage heavy-wire bond connection, in which an end bond section of the heavy wire, which extends towards an end of the heavy wire is bonded to the substrate, such that in an area of the bond section, a bond contact between the heavy wire and the substrate is formed,
- wherein the heavy wire has a tapering section, which is adjoined to the wire end and in which a cross-section of the wire tapers towards the wire end.
A method for producing a heavy-wire bond arrangement comprising:
- providing a substrate;
- providing a heavy wire;
- and
- forming a high-voltage heavy-wire bond connection, by bonding an end bond section of the heavy wire, which extends towards an end of the heavy wire, to the substrate, such that in an area of the bond section, a bond contact between the heavy wire and the substrate is formed,
- wherein the heavy wire is formed with a tapering section, which adjoins the end of the wire and in which a diameter of the wire tapers towards the end of the wire.
Dependencies are inferred from the claim text.