US 2013/0220533 A1 · PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD

Abstract

The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200° C. or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.

Claims16

Dependent claims

An adhesive composition, comprising:

an adhesive component;
a photoinitiator;
and
a silicone compound containing a functional group that is crosslinkable with the adhesive component.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

13/822,731Filed 14 Sep 2011

Priority

JP 2010-20828616 Sep 2010

Published

29 Aug 2013

Term ends

Not estimatedThe source records don’t support an estimate.

Classification23 codes

H10P 72/7402
Using temporarily an auxiliary support: wafer tapes, e.g. grinding or dicing support tapes
B32B 38/10
Ancillary operations in connection with laminating processes: removing layers, or parts of layers, mechanically or chemically
C08L 83/04
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with…
C09J 7/38
Characterised by the adhesive composition: pressure-sensitive adhesives [PSA]

Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method

Life of this patent

Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method

Life of this patent

Abstract

Claims16