Encapsulated electronic pressure sensor

Encapsulated electronic pressure sensor (1), comprising a sensor chip (5) configured to measure fluid pressure, comprising an encapsulation (2) and a support (4) fitted into said encapsulation (2), wherein:

• said support (4) comprises, on an upper side thereof, a recess (41) for the sensor chip (5), wherein said recess (41) also houses a cushion (42) with a central hole, as well as an electrical connector (45), projecting downwards from the lower face of the support (4), wherein the terminals of said electrical connector (45) are electrically connected to the outlet terminals of the sensor chip (5);
• and
• said encapsulation (2) comprises a horizontal structural portion (21), from which a mechanical engagement (22), a bed (23) and a connection (24) project, wherein said bed (23) has an approximately cylindrical conformation, with a flat top (30) with a central hole and an octagonal side surface (31) with alternate round and flat walls, wherein the internal surface delimited by said walls have a similar and/or cooperative geometry with the side surface of the support (4);
• the bottom surface of the recess (41) of the support (4), the cushion (42) and the top (30) of the bed (23) of the encapsulation defining an open chamber, inside which the sensor chip (5) is located, wherein said chamber is in fluid communication with a source of the pressure to be measured by the sensor chip (5) through the light of the connector (24) and the central hole as included on the top (30) of the bed (23).