Cooling system, substrate processing apparatus having cooling system and cooling method
AssigneeTokyo Electron Limited
InventorYasuharu Sasaki
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AssigneeTokyo Electron Limited
InventorYasuharu Sasaki
Estimating the term…
A cooling system can control a coolant temperature with a simple configuration. The cooling system 90 includes a vaporization vessel 80, a first fluid source 92, a first flow rate control unit 91, and a pressure control unit 99. The vaporization vessel 80 has a space, a supply opening 80a and a discharge opening 80b through which the coolant is supplied and discharged, respectively. The first fluid source 92 stores a first fluid having a vapor pressure higher than that of the coolant. The first flow rate control unit 91 connects the first fluid source 92 to the vaporization vessel 80 and controls a first fluid supply amount into the vaporization vessel. The pressure control unit 99 controls an internal pressure within the vaporization vessel to be higher than the vapor pressure of the coolant and equal to or lower than that of the first fluid.
A cooling system of cooling a coolant, the cooling system comprising:
A cooling method of cooling a coolant, the cooling method comprising:
Dependencies are inferred from the claim text.