Mounting head unit, component mounting apparatus, and method of manufacturing a substrate

A component mounting apparatus, comprising:

• a retaining unit configured to retain a substrate;
• a rotating body including
• a rotating shaft,
• a negative-pressure path that is provided within the rotating shaft and configured to flow negative-pressure gas therethrough,
• a non-negative-pressure path that is configured to flow non-negative-pressure gas therethrough and provided within the rotating shaft to be aligned with the negative-pressure path in an axial direction of the rotating shaft, and
• a partition that is provided within the rotating shaft and configured to separate the negative-pressure path from the non-negative-pressure path;
• a nozzle that includes a flow path configured to flow gas therethrough, is connected to the rotating body such that the flow path is in communication with the negative-pressure path and the non-negative-pressure path of the rotating body, and configured to be capable of sucking a component by being supplied with the negative-pressure gas from the negative-pressure path and to mount the sucked component on the substrate retained by the retaining unit by being supplied with the non-negative-pressure gas from the non-negative-pressure path;
• and
• a valve mechanism configured to switch between a negative-pressure state and a non-negative-pressure state of the gas to be supplied into the nozzle.

A method of manufacturing a substrate by a component mounting apparatus including a retaining unit configured to retain a substrate and a mounting head unit configured to mount a component on the substrate, the mounting head unit including

• a rotating body including
• a rotating shaft,
• a negative-pressure path that is provided within the rotating shaft and configured to flow negative-pressure gas therethrough,
• a non-negative-pressure path that is configured to flow non-negative-pressure gas therethrough and provided within the rotating shaft to be aligned with the negative-pressure path in an axial direction of the rotating shaft, and
• a partition that is provided within the rotating shaft and configured to separate the negative-pressure path from the non-negative-pressure path,
• a nozzle that includes a flow path configured to flow gas therethrough and is connected to the rotating body such that the flow path is in communication with the negative-pressure path and the non-negative-pressure path of the rotating body, and
• a valve mechanism configured to switch between a negative-pressure state and a non-negative-pressure state of the gas to be supplied into the nozzle, the method comprising:
• sucking the component by the nozzle supplied with the negative-pressure gas from the negative-pressure path;
• and
• mounting the sucked component on the substrate retained by the retaining unit, by supplying the non-negative-pressure gas from the non-negative-pressure path to the nozzle.