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US 2013/0213247 A1Published application
Stencil apparatus for printing solder paste
AssigneeSamsung Electronics Co., Ltd.
InventorsYong Won LEE, Ji Young Jang, Young Jun Moon, Soon Min Hong
Life of this patent
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Abstract
A solder paste printing stencil apparatus for printing a solder paste on a printed circuit board includes a plate-shaped stencil mask made of fine stainless steel grains to suppress a phenomenon in which the solder paste adheres to the stencil mask.
Claims19
A solder paste printing stencil apparatus comprising:
- a stencil mask having a plate shape,
- wherein the stencil mask is made of fine stainless steel grains.
A system to print solder paste comprising:
- a stencil mask;
- and
- a squeegee to move the solder paste on a surface of the stencil mask,
- wherein the stencil mask and the squeegee comprise grains of material having a grain size less than the grain size of the solder paste.
1 more element
A method of decreasing the adhesion of solder paste to a surface of a material, the method comprising:
- forming a surface on the material comprising grains of material having a grain size less than the grain size of the solder paste.
Dependencies are inferred from the claim text.