CMP Pad Cleaning Apparatus

A chemical mechanical polishing (CMP) tool, comprising:

• a workpiece carrier configured to house a semiconductor workpiece;
• a polishing pad located on a platen configured to rotate around an axis of rotation;
• a conditioning element comprising a diamond grit conditioning pad that faces a top surface of the polishing pad and that is configured to condition the top surface of the polishing pad to improve mechanical polishing performance;
• a megasonic cleaning element configured to remove defects from the polishing pad;
• and
• a high pressure fluid jet configured to apply a high pressure two fluid mist to the surface of the polishing pad to remove residue.

A method for cleaning a chemical mechanical polishing pad, comprising:

• bringing a workpiece into contact with a surface of the chemical mechanical polishing pad to perform chemical mechanical polishing of the workpiece;
• operating a pad conditioning element to condition the chemical mechanical polishing polishing pad;
• operating a first cleaning element to dislodge defects from the surface of the chemical mechanical polishing pad;
• and
• operating a second cleaning element to remove residues from the surface of the chemical mechanical polishing pad.