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US 2013/0200786 A1Published application
Plasma Cell and Method of Manufacturing a Plasma Cell
AssigneeInfineon Technologes AG
InventorDirk Meinhold
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Abstract
A plasma cell and a method for making a plasma cell are disclosed. In accordance with an embodiment of the present invention, a cell comprises a semiconductor material, an opening disposed in the semiconductor material, a dielectric layer lining a surface of the opening, a cap layer closing the opening, a first electrode disposed adjacent the opening, and a second electrode disposed adjacent the opening.
Claims23
A cell comprising:
- a semiconductor material;
- an opening disposed in the semiconductor material;
- a dielectric layer lining a surface of the opening;
- a cap layer closing the opening;
- a first electrode disposed adjacent the opening;
- and
- a second electrode disposed adjacent the opening.
4 more elements
A panel comprising:
- a semiconductor material;
- and
- a plurality of cells, each cell comprising:
- an opening disposed in the semiconductor material;
- a dielectric layer lining a surface of the opening;
- a cap layer sealing the opening;
- a first electrode disposed adjacent the opening;
- and
- a second electrode disposed adjacent the opening.
6 more elements
A method for manufacturing a semiconductor device, the method comprising:
- forming an opening in a semiconductor material;
- lining the opening with a dielectric layer;
- closing the opening with a cap layer;
- forming a first electrode adjacent the opening;
- and
- forming a second electrode adjacent the opening.
3 more elements
Dependencies are inferred from the claim text.