Methods of forming layers
AssigneeSeagate Technology LLC
InventorPhilip George Pitcher
Life of this patent
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Abstract
A method of forming a layer, the method including providing a substrate having at least one surface adapted for deposition thereon; and directing a particle beam towards the surface of the substrate, the particle beam including moderately charged ions (MCIs), substantially all the MCIs independently have charges from ±2 to ±6 and kinetic energies of not greater than about 200 eV, wherein the MCIs do not penetrate more than about 30 Å into the surface of the substrate to form a layer on the substrate.
Claims20
A method of forming a layer, the method comprising:
- providing a substrate having at least one surface adapted for deposition thereon;
- and
- directing a particle beam towards the surface of the substrate, the particle beam comprising moderately charged ions (MCIs), substantially all the MCIs independently have charges from ±2 to ±6 and kinetic energies of not greater than about 200 eV,
- wherein the MCIs do not penetrate more than about 30 Å into the surface of the substrate to form a layer on the substrate.
A method of forming a layer, the method comprising:
- providing a substrate having at least one surface adapted for deposition thereon;
- and
- directing a particle beam towards the surface of the substrate, the particle beam comprising moderately charged ions (MCIs), substantially all the MCIs independently have charges from ±2 to ±10 and kinetic energies of not greater than about 2000 eV,
- wherein the MCIs do not penetrate more than about 50 Å into the surface of the substrate to form a layer on the substrate.
A method of forming a layer, the method comprising:
- providing a substrate having at least one surface adapted for deposition thereon;
- and
- directing a particle beam towards the surface of the substrate, the particle beam comprising moderately charged ions (MCIs) wherein substantially all the MCIs independently have charges from ±2 to ±10 and kinetic energies have kinetic energies between about 5 eV and 2000 eV, and wherein the particle beam is directed at the surface using at least an accel-decel beam transport technique,
- wherein the MCIs do not penetrate more than about 50 Å into the surface of the substrate to form a layer on the substrate.
Dependencies are inferred from the claim text.