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US 2013/0200162 A1Published application
Rfid chip package and rfid tag
AssigneeMurata Manufacturing Co., Ltd.
InventorsYuya DOKAI, Koji SHIROKI
Life of this patent
Estimating the term…
Abstract
An RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element. A reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω.
Claims18
An RFID chip package comprising:
- an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band;
- and
- a power supply circuit connected to the RFID chip and including at least one inductance element;
- wherein
- a reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω.
2 more elements
An RFID tag including:
- an antenna element including a connection portion;
- and
- an RFID chip package connected to the connection portion;
- wherein
- the RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element;
- and
- a reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω.
4 more elements
Dependencies are inferred from the claim text.