Back to results
US 2013/0200092 A1Published application
Folding type package
AssigneeSamsung Eletronics Co., Ltd.
InventorsDong-jun KIM, In-hye Kim, Jung-hyeon Kim, Young-chai Heo
Life of this patent
Estimating the term…
Abstract
A folding type package includes a body including first and second parts to face each other when the body is folded to enclose a product, at least one product housing part formed at the body, and a buffer part extending from the product housing part to secure a buffer space to buffer a shock applied to the product.
Claims23
A folding type package, comprising:
- a body comprising first and second parts to face each other when the body is folded to enclose a product;
- at least one product housing part formed at the body;
- and
- a buffer part extending from the product housing part to secure a buffer space to buffer a shock applied to the product.
1 more element
A folding type package to prevent a product from experiencing a shock, comprising:
- a first part to house a portion of the product and comprising a first buffer part extending from the first part to absorb the shock applied to the first part;
- and
- a second part coupled to the first part to house another portion of the product not housed by the first part and comprising a second buffer part to mirror the first buffer part.
Dependencies are inferred from the claim text.