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US 2013/0199833 A1Published application
Circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Wook Park, Chang Bae Lee, Christian Romero, Mi Jin Park
Life of this patent
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Abstract
Disclosed herein is a circuit board including: a base substrate including a via for power and a via pad for power connected to the via for power; and an insulating layer formed on the base substrate and including a dummy pattern formed in a region facing the via pad for power.
Claims9
A circuit board comprising:
- a base substrate including a via for power and a via pad for power connected to the via for power;
- and
- an insulating layer formed on the base substrate and including a dummy pattern formed in a region facing the via pad for power.
Dependencies are inferred from the claim text.