Composite build-up materials for embedding of active components
AssigneeAtotech Deutschland GmbH
InventorsNorbert Galster, Jurgen Kress, Hugh Laver
Life of this patent
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Abstract
Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding active components such as micro chips. The composite build-up materials comprise a carrier layer (1), a resin layer with reinforcement (2), and a resin layer without reinforcement (3). The active component (6) is embedded into the resin layer without reinforcement (6).
Claims23
A method for embedding active components comprising, in this order, the following steps
- (i) providing a carrier layer having a thickness of 1 to 400 μm,
- (ii) coating the carrier layer with a first resin,
- (iii) laminating a reinforcement into the resin coated in step (ii) to form a resin layer with reinforcement having a thickness of 1 to 200 μm,
- (iv) coating the resin layer with reinforcement with a second resin to form a resin layer without reinforcement having a thickness of 1 to 500 μm and
- (v) embedding an active component in the resin layer without reinforcement.
A composite build-up material suitable for embedding active components, the composite build-up material having a layer sequence in the following order
- a carrier layer having a thickness of 1 to 400 μm,
- (ii) a resin layer with reinforcement having a thickness of 1 to 200 μm wherein the resin layer with reinforcement is free of metal structures and
- (iii) a resin layer without reinforcement having a thickness of 1 to 500 μm.
Dependencies are inferred from the claim text.