Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsMasaki Morita, Konatsu Nakamura, Shin Takanezawa
Life of this patent
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Abstract
By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
Claims25
A resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and having a structural unit derived from an alkylene glycol having a carbon number of from 3 to 10 in a main chain thereof, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator.
A method of manufacturing a wiring board including (a) a step of forming an uncured resin layer on a substrate having a circuit of a wiring conductor by using a resin composition containing an epoxy resin having two or more epoxy groups in one molecule thereof and having a structural unit derived from an alkylene glycol having a carbon number of from 3 to 10 in a main chain thereof, an ultraviolet ray active ester group-containing compound and an epoxy resin curing accelerator;
- (b) a step of thermally curing the uncured resin layer and subsequently irradiating with ultraviolet rays to form a cured resin layer;
- and (c) a step of subjecting the cured resin layer to an electroless plating treatment.
A method for manufacturing a wiring board having an insulating resin layer and a wiring formed on the surface of the insulating resin layer, which performs successively
- a laminate forming step of forming a laminate having the insulating resin layer and a support,
- a hole forming step of providing a hole in the laminate,
- a desmearing treatment step of removing a smear within the hole with a desmearing treatment liquid,
- a support removal step of removing the support from the laminate, and
- a wiring forming step of forming the wiring on the surface of the insulating resin layer from which the support has been removed, wherein
- an ultraviolet ray irradiation step of irradiating ultraviolet rays on the surface of the insulating resin layer from which the support has been removed, to enhance an adhesive force to the wiring is included after the laminate forming step and before the wiring forming step.
Dependencies are inferred from the claim text.