Printed circuit board with cavity
AssigneeSchweizer Electronic AG
InventorThomas Gottwald
Life of this patent
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Abstract
A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.
Claims17
A printed circuit board multilayer construction, comprising:
- a layer stack of several electrically insulating and/or conductive layers arranged one above the other, and a cavity in the interior of the layer stack, which cavity extends laterally only into a partial region of the areal extent of the layer stack, through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction, and is sealed relative to ingress of liquid.
A method for producing a printed circuit board multilayer construction comprising a layer stack of several electrically insulating and/or conductive layers arranged one above the other, and a cavity in the interior of the layer stack, which cavity extends laterally only into a partial region of the areal extent of the layer stack, through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction, and is sealed relative to ingress of liquid, the method comprising the steps of:
- providing an inner film or a multilayer core;
- producing a cutout in the inner film or the multilayer core;
- arranging the further layers of the layer stack below and/or above the inner film provided with the cutout or the multilayer core provided with the cutout, whereby a cavity is formed in the interior of the layer stack, which cavity extends laterally only in a partial region of the areal extent of the layer stack;
- laminating together and/or sandwiching the multilayer arrangement thus obtained;
- individually providing at least one opening in one or more of the layers forming the layer stack so that the cavity formed is exposed to a pressure surrounding the printed circuit board multilayer construction;
- and
- sealing the cavity formed relative to ingress of liquid.
Dependencies are inferred from the claim text.