High-frequency circuit substrate
AssigneeSumitomo Electric Fine Polymer, Inc.
InventorsMakoto Nakabayashi, Kazuaki Ikeda
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Abstract
The invention offers a high-frequency circuit substrate that sufficiently decreases the transmission delay and transmission loss in comparison with the conventional high-frequency circuit substrate. In the offered high-frequency circuit substrate, a dielectric layer made of fluororesin is brought into intimate contact directly with a metal conductor that is used for wiring and that has a surface not subjected to coarsening treatment or primer treatment. The offered high-frequency circuit substrate causes a transmission loss of −3 dB/m or less at a frequency of 1 GHz and has a combined specific inductive capacity of 2.6 or less and a combined dielectric loss tangent of 0.0007 or less.
Claims9
A high-frequency circuit substrate, comprising:
- a metal conductor that is used for wiring and that has a surface not subjected to coarsening treatment or primer treatment;
- and
- a dielectric layer that is made of fluororesin and that is brought into intimate contact directly with the metal conductor;
- the substrate causing a transmission loss of −3 dB/m or less at a frequency of 1 GHz.
Dependencies are inferred from the claim text.