Composite build-up material for embedding of circuitry
AssigneeAtotech Deutschland GmbH
InventorsAlex Bruderer, Norbert Galster, Jurgen Kress, Michel Probst
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Abstract
Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).
Claims20
A method for embedding of circuitry, the method comprising, in this order, the steps
- i. providing a carrier layer having a thickness of 1 to 200 μm,
- ii. coating the carrier layer with a first resin to form a resin layer without reinforcement having a thickness of 1 to 150 μm,
- iii. coating the resin layer without reinforcement with a second resin,
- iv. laminating a reinforcement into the second resin coated in step (iii) to form a resin layer with reinforcement having a thickness of 1 to 200 μm,
- v. detaching said carrier layer and
- vi. generating tracks inside the resin layer without reinforcement by a laser ablating technique.
A composite build-up material suitable for embedding of circuitry, the composite build-up material having a layer sequence in this order of
- (i) a carrier layer having a thickness of 1 to 200 μm
- (ii) a resin layer without reinforcement having a thickness of 1 to 150 μm and
- (iii) a resin layer with reinforcement having a thickness of 1 to 200 μm.
(canceled)
Dependencies are inferred from the claim text.