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US 2013/0199771 A1Published application
Heat-dissipating substrate for led
AssigneeUbe Industries, Ltd.
InventorsShigeyasu Yamaguchi, Osamu Nakayama, Keigo Nagao, Takuro Kochiyama, Atsushi Mizutare
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Abstract
The present invention relates to a heat-dissipating substrate for LED, comprising a polyimide film, a copper foil or a copper alloy foil which is laminated on one side of the polyimide film, and an aluminum foil or an aluminum alloy foil which is laminated on the other side of the polyimide film, in which the thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8° C./W or less.
Claims8
1-7. (canceled)
A heat-dissipating substrate for LED, comprising
- a polyimide film,
- a copper foil or a copper alloy foil, which is laminated on one side of the polyimide film, and
- an aluminum foil or an aluminum alloy foil, which is laminated on the other side of the polyimide film;
- wherein the thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8° C./W or less.
1 more element
Dependencies are inferred from the claim text.