Sprdr- heat spreader- tailorable, flexible, passive
OwnerGabe Cherianinventor
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OwnerGabe Cherianinventor
Estimating the term…
New heat spreaders are proposed to connect high power, high heat generating electronic devices to their downstream heat dissipating cooling components. First, the spreaders distribute the high heat flux over a wider surface area, thus reducing the flux to levels more easily handled by the downstream cooling system. Second, the spreaders incorporate flexible columns or elements to join the electronic devices to the main body of the spreader, so as to negate the undesirable effects of CTE mismatch. Columns with a higher standoff distance between the components are more flexible than a direct flat interface attachment between the heat source and the heat sink, and will have less chance of delaminating. Several embodiments are proposed and can be used in appropriate situations. The heat spreaders can be helpful in harsh environments and in high heat generating applications, such as spacecraft, satellites, as well as land locked high power computer systems.
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[See FIGS. 14+, 11-13, 21-26, 43-48, 62-75] A heat spreader, for transferring heat from an heat source, CC, to a heat dissipating device, HDD,
[See FIGS. 70,82-A,83] A carrier device, e.g. a chip carrier or a Printed Circuit Board, for providing support and protection to electronic devices, e.g. Integrated Circuit Chips, ICC, or other Chip Carriers, CCs, or other devices, wherein
[See FIGS. 78 and 79] In a two-phase flat heat pipe chamber, similar to the devices known in the industry as Therma Base or Therma Vapor Chamber or Flat Plate Heat Pipe, used for cooling various devices, wherein
Dependencies are inferred from the claim text.