Apparatus for secure device to edge of plate
OwnerTaiming Cheninventor
Life of this patent
Estimating the term…
Abstract
Apparatuses to secure surface mount heat emitting device with back heat spreader to edge of a heat dissipate plate in order to conduct heat from said heat emitting device to heat dissipate plate directly. Each apparatus comprising of adapter PCB with device mounting pads on surface and opening at location of back heat spreader to expose it for contact access; heat dissipate plate has contact stub to make contact with said back heat spreader and bounding means to bound together said heat dissipate plate and PCB.
Claims13
1) An apparatus to secure heat emitting device with back heat spreader to edge of a heat dissipate plate, said apparatus comprising of:
- a) An adapter PCB for mounting said heating emitting device and securing to edge of heat dissipate plate, said adapter PCB includes:
- i) mounting pads for solder said heat emitting device on to PCB surface,
- ii) Hole under said heat emitting device for exposing said device's heat spreader to said heat dissipate plate,
- iii) shape of said PCB is narrower at first dimension and wider at second dimension for locking said PCB when rotated,
- b) Seating means on edge of said heat dissipate plate to accept said adapter PCB, said seating means include:
- i) a first cut out with opening matches the width of said first dimension of adapter PCB and depth greater than thickness of said adapter PCB,
- ii) two right angled slots on symmetric location of both sides of first cut out with width matches to thickness of said adapter PCB for accepting said PCB when inserted and rotated,
- iii) contact stub at edge of said heat dissipate plate with width that can fit into said hole of adapter PCB and has length to touch heat spreader of said heat emitting device through said adapter PCB when PCB is inserted and secured with said seating means.
3) An apparatus to secure heat emitting device with back heat spreader to edge of a heat dissipate plate, said apparatus comprising of:
- a) At least one heat emitting device that has a plurality of mounting points and back heat spreader, said mounting points and back heat spreader is aligned to be mount on a plane surface;
- b) A PCB with two sides for mounting at least one said heat emitting device and securing said devices to edge of said heat dissipate plate, said PCB includes:
- i) a plurality of mounting pads on first side of PCB surface for soldering said mounting points of heat emitting devices on to said first side of PCB,
- ii) at least one through opening between first and the opposite side, or second side, of said PCB to allow contact surface of said heat dissipate plate to pass through said PCB from second side to come out of first side of PCB;
- c) At least one heat dissipate plate to dissipate heat from said heat emitting devices, said heat dissipate plate includes:
- i) Plate has main body and surface area on both sides of plate to dissipate heat away from said heat emitting device,
- ii) A least one contact tab connect to but stick out of said plate main body for the length of equal or greater than the thickness of said PCB for fitting through said PCB through opening,
- iii) at least one contact surface on edge side of said contact tab to made proper contact with back heat spreader of said heat emitting device alongside the first side of said PCB;
- d) Bounding means to secure said PCB to said heat dissipate plate.
Dependencies are inferred from the claim text.