Heat-dissipating module having loop-type vapor chamber

A heat-dissipating module having a loop-type vapor chamber, mounted on a plurality of heat-generating electronic elements of a circuit board and including:

• a heat-dissipating body;
• a loop-type vapor chamber disposed on one side of the heat-dissipating body and completely covered by the heat-dissipating body, the loop-type vapor chamber comprising a loop body, a wick structure and a supporting structure, the loop body being enclosed by two long sides and two short sides to form a hollow rectangular body, a vacuum chamber being formed in the interior of the long sides and the short sides, the wick structure being arranged on inner surfaces of the long sides and the short sides, the supporting structure abutting the wick structure toward the inner surfaces of the long sides and the short sides;
• a heat-conducting medium by which the loop-type vapor chamber is tightly connected to the heat-dissipating body;
• and
• a plurality of fixing plates, some of the fixing plates being disposed to cross connecting portions between the long sides and the short sides, and the rest of the fixing plates being disposed to cross the long sides, the fixing plates being arranged in parallel to each other symmetrically and positioned to correspond to the heat-generating electronic elements respectively.