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US 2013/0199726 A1Published application
Apparatus and a method for treating a substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsHongjin KIM, Kyoungseob KIM, SungHo SHIN, Kuntack LEE, Kihong CHO
Life of this patent
Estimating the term…
Abstract
A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.
Claims12
-9. (canceled)
A substrate treating apparatus comprising:
- a supporting unit configured to support a substrate;
- a nozzle unit configured to jet a fluid containing an abrasive onto the substrate;
- and
- a supplying unit configured to supply the fluid to the nozzle unit.
1 more element
A substrate treating apparatus comprising:
- a first module configured to jet a fluid containing an abrasive through a nozzle to a substrate;
- and
- an second module configured to transfer the substrate to the first module, wherein the nozzle is positioned over a top surface of the substrate or is positioned adjacent to a side of the substrate.
Dependencies are inferred from the claim text.