Substrate Treating Apparatus And Substrate Treating Method
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsHiroyuki Araki, Kentaro Tokuri
Life of this patent
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Abstract
A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried.
Claims9
A substrate processing apparatus comprising:
- a substrate holding mechanism capable of holding a substrate substantially horizontally;
- a rinsing liquid supply mechanism for supplying a rinsing liquid onto the top of the substrate held by the substrate holding mechanism;
- a gas knife mechanism capable of spraying gas onto the top of the substrate held by the substrate holding mechanism to form a gas spraying zone on the substrate top, and also capable of unidirectionally scanning the substrate top in its entirety by the gas spraying zone;
- a rinsing liquid replenishing mechanism for supplying a rinsing liquid onto the substrate top at its area downstream in the gas-spraying-zone scanning direction with respect to the gas spraying zone formed by the gas knife mechanism;
- and
- substrate drying means for drying the surface of the substrate held by the substrate holding mechanism.
A substrate processing method comprising:
- a substrate holding step of holding a substrate substantially horizontally by a substrate holding mechanism;
- a rinsing liquid supply step of supplying a rinsing liquid onto a top of the substrate held by the substrate holding mechanism at the substrate holding step;
- a gas knife step of spraying, after the rinsing liquid supply step, gas onto the top of the substrate held by the substrate holding mechanism, by a gas knife mechanism to form a gas spraying zone on the substrate top, and of unidirectionally scanning the substrate top in its entirety by the gas spraying zone;
- a rinsing liquid replenishing step of supplying, in parallel to the gas knife step, a rinsing liquid onto the substrate top at its area downstream in the gas-spraying-zone scanning direction with respect to the gas spraying zone formed by the gas knife mechanism;
- and
- a drying step of drying the substrate top after the gas knife step and the rinsing liquid replenishing step.
Dependencies are inferred from the claim text.