Bonding Stress Testing Arrangement and Method of Determining Stress

The bonding stress testing arrangement of claims any one of 24 to 26,

• wherein the plurality of groups of sensors comprises groups of sensors of a first polarity and groups of sensors of a second polarity.

A method of determining stress on a portion of a bonding area under at least one bond pad, the method comprising any one of:

• measuring an average stress on a portion of a bonding area under the at least one bond pad, and
• determining stress distribution over a portion or an entire of the bonding area under the at least one bond pad.

The method of claims any one of 69 to 71,

• wherein the plurality of groups of sensors comprises groups of sensors of a first polarity and groups of sensors of a second polarity.