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US 2013/0199295 A1Published application
Damping device for a micromechanical sensor device
AssigneeRobert Bosch GmbH
InventorsHolger HOEFER, Ricardo EHRENPFORDT, Klaus OFFTERDINGER, Christian SOLF
Life of this patent
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Abstract
A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.
Claims20
A damping device for a micromechanical sensor device, comprising:
- at least one first intermediate layer having at least two sections, a second one of the sections being situated around a first one of the sections, a lateral distance being provided between the first section and the second section, and an elastic device situated between the first section and the second section as an integral part of the first intermediate layer.
A method for producing a damping device for a micromechanical sensor device, comprising:
- producing a circumferential gap in a first intermediate layer having a printed circuit board material, at least one elastic device being provided in an area between a first section and a second section, the elastic device being provided as an integral part of the first intermediate layer.
Dependencies are inferred from the claim text.