Carrier for manufacturing printed circuit board and method for manufacturing the carrier
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKwang Yune Kim, Tae Eun Chang, Suk Hyeong Cho
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Abstract
Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board.
Claims12
A carrier for manufacturing a printed circuit board, the carrier comprising:
- a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers;
- and
- a protecting unit completely wrapping an outskirt part of the core member.
A method for manufacturing a carrier for manufacturing a printed circuit board, the method comprising:
- forming a core member by stacking first metal layers on both surfaces of a base substrate and then stacking each of second metal layers on one surface of each of the first metal layers;
- performing hole punching on the core member such that a distance between holes is 500 mm;
- forming a protecting unit by stacking a protecting member on the core member and then performing pressing thereon, the protecting unit completely wrapping an outskirt part of the core member;
- and
- forming a buffer zone by trimming the protecting unit.
Dependencies are inferred from the claim text.