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AssigneeInternational Test Solutions, Inc.
InventorsAlan E. Humphrey, James H. Duvall, Jerry Broz
Estimating the term…
A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one ore more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
A method of making an uncompressed integrated chip manufacturing apparatus cleaning wafer, the integrated chip manufacturing apparatus having a first section configuration and a second section configuration different than the first section configuration, the method comprising the steps of:
An uncompressed integrated chip manufacturing apparatus cleaning wafer of the type useable to clean an integrated chip manufacturing apparatus, the uncompressed integrated chip manufacturing apparatus cleaning wafer comprising a resilient cleaning pad having a first cleaning side and a second side, the first cleaning side including:
An uncompressed integrated chip manufacturing apparatus cleaning wafer of the type useable to clean an integrated chip manufacturing apparatus, the uncompressed integrated chip manufacturing apparatus cleaning wafer comprising:
Dependencies are inferred from the claim text.