Circuit assembly yield prediction with respect to form factor

A system comprising:

• a design subsystem configured to generate a design specification for a circuit assembly comprising a plurality of circuit components, each circuit component being populated in the circuit assembly according to the design specification;
• and
• a yield prediction subsystem, configured, for each of the plurality of circuit components, to:
• identify a set of component attributes corresponding to the electronic component according to an attribute database;
• assign a set of possible defects as a function of its respective set of component attributes, each of the set of possible defects being associated with a predicted frequency of occurrence, the predicted frequency of occurrence of at least one defect being a function of spacing or placement of the electronic component;
• determine, according to the design specification, a predicted spacing or placement of the electronic component with respect to each of a plurality of form factors for the circuit assembly;
• calculate a first predicted defect frequency for the electronic component as a function of a first form factor for the circuit assembly;
• and
• calculate a second predicted defect frequency for the electronic component as a function of a second form factor for the circuit assembly,
• wherein the yield prediction subsystem is further configured to:
• calculate a first yield prediction for the circuit assembly corresponding to the first form factor as a function of the first predicted defect frequencies of the plurality of circuit components;
• and
• calculate a second yield prediction for the circuit assembly corresponding to the second form factor as a function of the second predicted defect frequencies of the plurality of circuit components.

A computer program product residing on a non-transitory, processor-readable medium and having processor-readable instructions, which, when executed, cause a processor to perform steps comprising:

• identifying a design specification for a circuit assembly comprising a plurality of circuit components, each circuit component being populated in the circuit assembly according to the design specification;
• for each of the plurality of circuit components:
• identifying a set of component attributes corresponding to the electronic component according to an attribute database;
• assigning a set of possible defects as a function of its respective set of component attributes, each of the set of possible defects being associated with a predicted frequency of occurrence, the predicted frequency of occurrence of at least one defect being a function of spacing or placement of the electronic component;
• determining, according to the design specification, a predicted spacing or placement of the electronic component with respect to each of a plurality of form factors for the circuit assembly;
• calculating a first predicted defect frequency for the electronic component as a function of a first form factor for the circuit assembly;
• and
• calculating a second predicted defect frequency for the electronic component as a function of a second form factor for the circuit assembly;
• calculating a first yield prediction for the circuit assembly corresponding to the first form factor as a function of the first predicted defect frequencies of the plurality of circuit components;
• and
• calculating a second yield prediction for the circuit assembly corresponding to the second form factor as a function of the second predicted defect frequencies of the plurality of circuit components.