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US 2013/0172466 A1Published application
Polyphenylene Sulfide Resin Composition with Improved Thermal Conductivity and Surface Appearance and Articles Thereof
AssigneeCheil Industries Inc.
InventorsChan Gyun Shin, Jong Cheol Lim, Jeong Won Lee, Nam Hyun Kim
Life of this patent
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Abstract
A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.
Claims12
A polyphenylene sulfide resin composition comprising:
- (A) about 30 to about 50 wt % of a polyphenylene sulfide resin;
- (B) about 1 to about 5 wt % of an amorphous polyamide resin;
- and
- (C) about 45 to about 69 wt % of thermally conductive insulating fillers.
1 more element
Dependencies are inferred from the claim text.