Polyamide resin moldings
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsJun Mitadera, Masashi Kurokawa, Takahiro Takano
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Abstract
Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass.
Claims7
A polyamide resin molding, which is formed from a polyamide resin comprising a diamine structural unit and a dicarboxylic acid structural unit or a polyamide resin composition containing the polyamide resin,
- wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and which has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass.
Dependencies are inferred from the claim text.