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OwnerShinji Tsuchikawa, Hiroyuki Izumi +2inventors
InventorsShinji Tsuchikawa, Hiroyuki Izumi, Kumiko Ishikura, Hikari Murai
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Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same. The foregoing thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foil, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric characteristics, and drillability, achieves the high density and high reliability of wiring boards required at present, and can be widely used for production of electronic appliances and the like.
-5. (canceled)
A process for producing a compatibilized resin having an iminocarbonate structure and a triazine structure, comprising reacting (a) a siloxane resin having a hydroxyl group at an end thereof, which is represented by the following formula (I), (b) a compound having at least two cyanate groups in one molecule thereof, and (c) a compound having at least two epoxy groups in one molecule thereof, with proportions of the component (a), the component (b), and the component (c) being from 10 to 50 parts by mass, from 40 to 80 parts by mass, and from 10 to 50 parts by mass, respectively based on 100 parts by mass of a total amount of the components (a) to (c), in the presence of (d) an organic metal salt in a solvent selected among toluene, xylene, and mesitylene at from 80 to 120° C. at a rate of reaction of the component (b) of from 30 to 70% by mole:
A thermosetting resin composition comprising (A2) a thermosetting resin and (B) fused silica, wherein
A thermosetting resin composition comprising (A2) a thermosetting resin and (B) fused silica, wherein
Dependencies are inferred from the claim text.