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US 2013/0172453 A1Published application
Polyamide Resin Composition Having Improved Physical Properties Including Thin-wall Moldability
AssigneeCheil Industries Inc.
InventorsSang Hwa Lee, In Sik Shim, Jong Cheol Lim, In Geol Baek, Sun Ho Song, Pil Ho Kim
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Abstract
A polyamide resin composition comprises (A) about 10 to about 70% by weight of a crystalline polyamide resin, (B) about 10 to about 70% by weight of an amorphous polyamide resin, (C) about 5 to about 30% by weight of an inorganic filler, and (D) about 10 to about 50% by weight of a white pigment. The polyamide resin composition can have good thin-wall moldability, light reflectance, yellowing resistance, impact strength and heat resistance.
Claims19
A polyamide resin composition comprising:
- (A) about 10 to about 70% by weight of a crystalline polyamide resin;
- (B) about 10 to about 70% by weight of an amorphous polyamide resin;
- (C) about 5 to about 30% by weight of an inorganic filler;
- and
- (D) about 10 to about 50% by weight of a white pigment.
2 more elements
Dependencies are inferred from the claim text.