Integrated circuit with millimeter wave and inductive coupling and methods for use therewith
AssigneeBroadcom Corporation
InventorAhmadreza Rofougaran
Life of this patent
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Abstract
A circuit includes a plurality of integrated circuits or dies having corresponding circuits, the plurality of integrated circuits or dies include a first plurality of integrated circuits or dies having corresponding millimeter wave interfaces and a second plurality of integrated circuits or dies having corresponding inductive interfaces. The first plurality of integrated circuits or dies communicate first signals therebetween via the corresponding millimeter wave interfaces and the second plurality of integrated circuits or dies communicate second signals therebetween via the corresponding inductive interfaces.
Claims20
A method comprising:
- communicating first signals between a first integrated circuit die of an integrated circuit and a second integrated circuit die of the integrated circuit via a first millimeter wave intra-chip communication transceiver of the first integrated circuit die and a second millimeter wave intra-chip communication transceiver of the second integrated circuit die;
- communicating second signals between the first integrated circuit die of the integrated circuit and the second integrated circuit die of the integrated circuit via a first inductive intra-chip communication transceiver of the first integrated circuit die and a second inductive intra-chip communication transceiver of the second integrated circuit die.
A method comprising:
- communicating first signals between a first integrated circuit die of an integrated circuit and a second integrated circuit die of the integrated circuit via a first millimeter wave interface of the first integrated circuit die of the integrated circuit and a second millimeter wave interface of the second integrated circuit die of the integrated circuit;
- and
- communicating second signals between the second integrated circuit die of the integrated circuit and a third integrated circuit die of the integrated circuit a first inductive interface of the first integrated circuit die of the integrated circuit and a second inductive interface of the third integrated circuit die of the integrated circuit.
A method comprising:
- communicating first signals between a first plurality of integrated circuit dies of an integrated circuit via corresponding millimeter wave interfaces;
- and
- communicating second signals between a second plurality of integrated circuit dies of the integrated circuit via corresponding inductive interfaces.
A method comprising:
- communicating first signals between a first plurality of integrated circuits via corresponding millimeter wave interfaces;
- and
- communicating second signals between a second plurality of integrated circuits via corresponding inductive interfaces;
- wherein at least one of the first plurality of integrated circuits is included in the second plurality of integrated circuits.
Dependencies are inferred from the claim text.