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US 2013/0171901 A1Published application
Adhesive compound for hot-sealing inserts
AssigneeCarl Freudenberg KG
InventorsHeike Bartl, Cornelia Kinscherf, Oliver Staudenmayer, Ulrich Scherbel
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Abstract
An adhesive compound for a hot-sealing insert is provided, as are an insert that contains this adhesive compound, and a method for fixing the insert. The adhesive compound has a thermoplastic hot-melt adhesive (A) that is not adhesive at room temperature and a pressure sensitive adhesive (B) that is adhesive at room temperature.
Claims20
An adhesive compound for fusible interfacing comprising:
- a heat-activated thermoplastic adhesive (component A) that is not sticky at room temperature:
- and
- a contact adhesive (pressure-sensitive adhesive) that is tacky at room temperature (component B),
- wherein a proportion of component (A) is 5% to 40% by weight, preferably 10% to 30% by weight, relative to a total weight of a non-dried adhesive compound comprising all components, and
- wherein a proportion of component (B) is 30% to 95% by weight liquid, relative to the total weight of the non-dried adhesive compound comprising all of the components.
2 more elements
Dependencies are inferred from the claim text.