Method for manufacturing electronic component
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsTakeshi Saito, Tomomichi Takatsu
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Abstract
Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.
Claims4
A method for manufacturing an electronic component, comprising:
- (1) a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer by coating a pasty adhesive on the rear face of a wafer and curing the pasty adhesive partially by UV irradiation or heating into the sheet shape;
- (2) a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame by bonding them to a cohesive sheet;
- (3) a dicing step of dicing the wafer into semiconductor chips with a dicing blade;
- (4) a UV-irradiating step of irradiating ultraviolet ray;
- and
- (5) a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein:
- the cohesive sheet has a base film and a cohesive layer formed on one face of the base film;
- the cohesive constituting the cohesive layer contains 100 parts by mass of a (meth)acrylate ester copolymer (A), 5 to 200 parts by mass of a ultraviolet polymerizable compound (B), 0.5 to 20 parts by mass of a multifunctional isocyanate curing agent (C), 0.1 to 20 parts by mass of a photopolymerization initiator (D), and 0.1 to 20 parts by mass of a silicone polymer (E);
- the (meth)acrylate ester copolymer (A) is a copolymer of (meth)acrylate ester monomers or a copolymer of a (meth)acrylate ester monomer and a vinyl compound monomer, wherein neither the (meth)acrylate ester monomer nor the vinyl compound monomer contain any hydroxyl group;
- the ultraviolet polymerizable compound (B) contains a urethane acrylate oligomer (B1) and multifunctional (meth)acrylates (B2);
- the urethane acrylate oligomer (B1) has a weight-average molecular weight of 50000 or more, a polydiversity Mw/Mn, ratio of weight-average molecular weight Mw to number-average molecular weight Mn, of 5 or more, and a vinyl group number of 10 or more;
- the photopolymerization initiator (D) has one or more hydroxyl groups;
- and
- the silicone polymer (E) has hydroxyl groups.
A cohesive sheet for production of an electronic component, which is used as bonded to a semi-cured adhesive layer formed on the rear face of a wafer, comprising a base film and a cohesive layer formed on one face of the base film, wherein:
- the cohesive constituting the cohesive layer contains 100 parts by mass of a (meth)acrylate ester copolymer (A), 5 to 200 parts by mass of a ultraviolet polymerizable compound (B), 0.5 to 20 parts by mass of a multifunctional isocyanate curing agent (C), 0.1 to 20 parts by mass of a photopolymerization initiator (D), and 0.1 to 20 parts by mass of a silicone polymer (E);
- the (meth)acrylate ester copolymer (A) is a copolymer of (meth)acrylate ester monomers or a copolymer of a (meth)acrylate ester monomer and a vinyl compound monomer, wherein neither the (meth)acrylate ester monomer nor the vinyl compound monomer contains any hydroxyl group;
- the ultraviolet polymerizable compound (B) contains a urethane acrylate oligomer (B1) and multifunctional (meth)acrylates (B2);
- the urethane acrylate oligomer (B1) has a weight-average molecular weight of 50000 or more, a polydiversity Mw/Mn, ratio of weight-average molecular weight Mw to number-average molecular weight Mn, of 5 or more, and a vinyl group number of 10 or more;
- the photopolymerization initiator (D) has one or more hydroxyl groups;
- and
- the silicone polymer (E) has hydroxyl groups.
Dependencies are inferred from the claim text.