Semiconductor device and method for manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsKazuya FUKUHARA, Kiyonori YOSHITOMI, Takehiko IKEGAMI, Yujiro KAWASOE
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Abstract
A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package.
Claims8
1-14. (canceled)
A method for manufacturing a semiconductor device, comprising the steps of:
- providing a lead frame having a chip mounting area and a plurality of leads arranged around the chip mounting area;
- mounting a semiconductor chip having a plurality of electrode pads over the chip mounting area of the lead frame;
- coupling the leads and the electrode pads of the semiconductor chip electrically with each other through a plurality of bonding wires;
- and forming a resinous sealing body to seal the semiconductor chip, the bonding wires and a portion of the leads, wherein the bonding wires include:
- a first bonding wire coupled at one end portion thereof to a first electrode pad out of the electrode pads and at an opposite end portion thereof to a first lead out of the leads;
- and a second bonding wire coupled at one end portion thereof to a second electrode pad out of the electrode pads and at an opposite end portion thereof to the first lead and being thinner than the first bonding wire, and wherein the second bonding wire is formed later than the first bonding wire.
21-24. (canceled)
Dependencies are inferred from the claim text.