Exposed die pad package with power ring

A method of fabricating a packaged semiconductor, the method comprising:

• forming a conductive frame as an integral piece of conductive material, the conductive frame including
• an inner portion and
• a ring portion encircling the inner portion,
• wherein the ring portion includes (i) a first ring portion that encircles first and second sides of the inner portion, and (ii) a first bar portion located on a third side of the inner portion;
• mounting a semiconductor die to a first surface of the inner portion of the conductive frame, wherein the semiconductor die is configured to receive power via the first ring portion;
• applying a casing to the conductive frame, wherein the casing covers the semiconductor die;
• and
• after the casing is applied to the conductive frame, removing (i) sections of the conductive frame that connect the inner portion to the ring portion, and (ii) sections of the conductive frame that connect the first ring portion to the first bar portion.